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Semiconductor IC-Substrate PCB vertical drilling & precision grinding

Introductions

We have been specialising in the plugging resins business since 2007 and have accumulated more than 17 years of production and technical experience in the field.We have a professional technical team to provide customers with a full range of services.In order to ensure that the quality of products and environmental management meet international standards, we have passed the ISO9001 and ISO14001 system certification.Meanwhile, we have introduced advanced foreign hole plugging, grinding and AOI inspection equipment. We have established R&D centres for vertical hole plugging and precision grinding of semiconductor IC-Substrate PCB in South China and East China, and provide customized solutions according to customers' needs. We can provide a complete set of resin plugging solutions such as selective hole plugging, whole board hole plugging, multiple hole type hole plugging, hole plugging and grinding of metal substrate, etc. We are committed to providing customers with high quality and competitive price.

Plugging of holes

MASS GmbH and domestic SetSense vertical vacuum hole plugging machines are used.

Solves high aspect ratios, bubble problems and eliminates the need for jigs.

The paste plug head can continuously pressurise the  paste supply and has a high hole-entry capacity.

Selective Plugging Foundry

High machine stability, ES automatic balancing.

Visual screen to monitor the plugging process.

Mesh panels can be pulled out for easy cleaning and maintenance.

Completely solves the problem of bubbles and voids in high aspect ratio boards.

Processing Capability

NO.

Items

Plate Plugging

selective hole plugging

remark

1

Production Size

250*250mm-610*760mm

250*250mm-610*710mm

Exceeding specifications requires engineers to reassess feasibility.

2

Panel Thickness

0.2-8.0mm

0.2-8.0mm

Exceeding specifications requires engineers to reassess feasibility.

3

diameter of hole

Drilling diameter 0.15-0.8mm


Max. plug hole diameter to panel thickness ratio 1:1


Drill hole diameter ≥ 0.15

Exceeding specifications requires engineers to reassess feasibility.

4

copper-cladding thicknesses

Incoming copper 

≥25μm.

Plating hole filling grinding copper needs to be 

≥30μm

copper-clad≥15μm

Substrate leakage below 15μm is extremely risky.

5

Aspect Ratio

Through hole 40:1 Blind hole 1:1

Through hole 40:1 

Blind hole 3:1

Exceeding specifications requires engineers to reassess feasibility.

6

leave a margin at the edge of the board

Plate edges to be at a distance from the plug holes

≥15mm

not required

One side of the plate 

≥15mm is sufficient

7

Safe Hole 

Distance

-

Hole edge distance

≥0.3mm

Exceeding specifications requires engineers to reassess feasibility.

8

the large and small holes

Extreme difference in size of neighbouring holes

<0.3mm

Single PNL inner aperture extreme:

<0.3mm

≥0.2mm

Using two plug holes

9

Copper 

Reduction

Copper reduction for flatness of the board

3-5μm

-

Above 8μm, separate copper reduction is required.

Grinding subcontractor

With three multi-axis grinding lines.

We have extensive experience with thin and thick plates.

The special design of staggered arrangement of ceramics reduces the accumulation of copper sludge and chips caused by brush wheel abrasion.

Panel Size:250-250mm-610*760mm.

Plugging process introduction

Pre-treatment

washing,pre-baking and drying

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Plug holes

panel using vacuum screen

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Curing

Bake in sections to make the paste heated more evenly and avoid cracking.

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Grinding

Remove excess plugging ink with a ceramic brush + non-woven cloth.

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Check:AOI、visual examinationimage.png

NO.

Plug Hole Types

Materials

Photos

Remark

1

mixed pressure + high frequency and speed + back drilling

teflon+FR4

image.png

Panel thickness:1.6mm.

Plug hole aperture: 0.4mm.

Back drilling depth: 0.9mm.

2

multilayer

FR4

image.png

The number of layers of this board is 32 in total.

The panel thickness is 8.0mm, the copper of the finished hole is 0.10mm, and the aspect ratio is 80:1.

3

Blind + Through + Buried + Back Drilled

FR4

image.png

Hole diameter: 0.3mm.

Depth: 0.3mm.


4

Buried hole + through hole + HDI

M6

image.png

Aspect Ratio:40:1

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